1. As bilong Prodak
Em i lukluk long skelim 'ultra-thin thickness, high in-plane thermal conductivity na gutpela fleksibiliti, luksave long gutpela, laitweit na konfomal hat dissipesen, na stretim ol liklik na hai-pefomens divelopmen nid bilong ol nupela ilektronik ikwipmen.
2. Ol bikpela teknikel mak
|
Teknikel Paramita |
Tipikel Value (Yu ken stretim) |
Test Standet |
|
Tiknes |
0.01–0.10 mm |
ASTM D374 |
|
Insait long-plen Thermal Conductivity |
300–1500 W/(m·K) |
ASTM D5470 |
|
Mak bilong ol samting i pas pas wantim |
1.5-2.0 g/cm3 |
ASTM D792 |
|
Tempereja bilong wok |
-40 ~ 200 digri |
ISO 18773 |
|
Strong bilong 'Tensile' |
Bikpela o wankain olsem 15 MPa |
ASTM D882 |
|
Volium Resistiviti |
Bikpela o wankain olsem 1×1010 Ω·cm |
ASTM D257 |
3. Ol bikpela samting
Ultra-Thin & Flexible: Tiknes i stat long 0.01 mm i go inap 0.10 mm, wantaim gutpela 'bendability' na 'conformability'. Em inap long pas gut long ol hap we i no stret na i no bruk, na dispela i stret long liklik disain bilong ol ikwipmen.
Bikpela 'Thermal Conductivity': Insait long -plen 'thermal conductivity' i save kamap long 300-1500 W/(m·K), na i save senisim na rausim hariap hat, na i save daunim temperaja bilong wok bilong divais na i save mekim wok bilong en i go longpela.
Gutpela Pefomens: Em i save sanap strong long bikpela na liklik tempereja (-40 digri i go inap 200 digri), i no inap bagarap na i no inap kamap lapun. Em i save stap gut na i no gat senis o bagarap long wok bilong en long ol ples we i gat planti hevi, na i save givim gutpela lektrik insulesen long abrusim ol sot seket long ol 'precision components'.
Laitpela na i no bagarapim envairomen: Densiti bilong 1.5-2.0 g/cm3, i lait moa long ol samting bilong rausim hat (kopa, aluminium), na i no putim moa hevi long ol ikwipmen. I no gat posin, i no gat smel na i no gat polusen, i bihainim olgeta lo bilong lukautim envairomen.
Yu ken senisim: Tiknes, sais, seip bilong katim na 'thermal conductivity' i ken stret long ol kastoma aplikesen na ol teknikel rikwaemen.
4. Ol Fil bilong Aplikesen
Konsuma Elektroniks: Ol smatfon, tablet, laptop, ol smat wearabol (ol wats, ol iafon), ol gem konsol, ol i save yusim long rausim hat bilong ol CPU, ol bateri, ol sip na ol narapela bikpela samting.
Nupela Eneji: Ol pawa bateri pek, ol eneji stoa sistem, ol nupela eneji vehikel ilektronik kontrol sistem, ol pail bilong sasim, daunim gut tempereja bilong ol bateri modul na ol pawa divais long mekim sefti na stebiliti i kamap gutpela.
Ol samting bilong toktok: 5G bes stesin, ol optikal modul, ol routa, ol komyunikesen transiva, we i save wok long hai-pawa na hai-hat wok kondisen.
Indastrial na Aerospace: Ol medikel tes instramen, ol indastrial kontrol panel, ol aerospace presis ilektronik komponen, ol liklik na namel inveta, we i inapim ol hai-reliability heat dissipation rikwaemen bilong ol hai-end ikwipmen.
Dispela samting i bin winim strongpela kwaliti inspeksen. Mipela i save givim fri sempel, teknikel sapot na wan-stop kastomaisesen sevis long inapim ol kain kain 'thermal management' diman bilong ol global kastoma. Em i gat planti luksave olsem wanpela gutpela 'thermal management solution' insait long ol 'electronics' na 'new energy' indastri.
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